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The Electronic Components Technology Conference offers papers covering a wide spectrum of topics, including not only electronic components, but also new developments in all areas of electronics technology (such as electronics assembly, packaging, reliability, and materials). In 1998 over 240 papers, posters, and short courses were presented by companies, universities, and research institutes from around the world.Papers presenting new developments and knowledge in the following areas are invited:Components–New passive or active component technologies, integrated/embedded components, component application, component performance and reliability usability and reliability; Connectors–New or improved devices or technique, emphasis on high density and performance for multichip and surface mount applications; Education–education for engineering curricula in the 21st century and collaborative research and engineering programs between universities, government or industry; Interconnections–first level, cost-effective interconnection technologies including TAB, wirebond, flip-chip, conductive polymers, bare chip-on-glass, FR4 and flex for temporary or permanent interconnects. Special attention to an emerging technology–high density interconnect.Also: Manufacturing Technology–JIT, SPC, robotics, design for manufacturability, ISO cost identification and control, manufacturing processes, yield, test, manufacturing equipment; Materials and Processing–Adhesives, interconnection materials, ceramics, metals, composites, thermal materials; Modeling and Simulation–electrical, thermal, optical and mechanical modeling, simulation and characterization; Multichip Packaging–design, fabrication, new technologies for high density/high speed applications, known good die (KGD), and direct chip attach, MCM-C, MCM-D, MCM-L, 3-D, and hybrid packaging–SMT, thick and thin Film; Opto-Electronics–Packaging for fiber-optic modules, infra-red wireless, consumer opto-electronics, flat-panel, projection and micro displays, optical amplifiers, lasers, detectors, waveguides OEICs, and passive components and WDMs;Poster–Papers can be submitted on any of the listed major topics; Quality and Reliability–assessment failure analysis, reliability testing and data analysis, reliability modeling, accelerated models, qualification of components and systems, KGD, incremental quality improvement, TQM; Single Chip Packaging–New packaging technologies, designs, materials/configuration addressing performance, density and cost. Special emphasis on array, fine pitch, ultrathin and high lead count packaging, CSP, BGA enhanced SMT, DCA, COB.
electronic components sydney
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